IC Lead Frame Materials
Overview
Sealing materials are used widely in the production of electron tubes, transistors, integrated circuits, cathode ray tubes, etc. Sealing materials must have thermal expansion coefficients that correspond over a wide temperature range to those of glass and ceramics to which they are applied. In addition, sections in contact with glass and ceramics must have excellent mechanical strength.
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- Electronic Materials Business Unit
- Contact Information
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- Special contents
- A List of LCD Display and Semiconductor Package Components
