2004 The former Hitachi Cable News Release
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Development of mold-type micro BGA(R) (*1) package with high-speed transmission and high reliability
Hitachi Cable has developed and successfully mass-produced a mold-type micro BGA(R) using TAB tape.
In addition to standard micro BGA(R) package features of high-density mountability and high-speed transmission, the Hitachi Cable micro BGA(R) package uses a unique material (elastomer) between the TAB tape and semiconductor chip to ensure outstanding reliability, allowing use with previously high-end memory packages.
While innovations in semiconductor technology in recent years have steadily reduced the dimensions of semiconductor chips, TAB tape dimensions must be held constant in order to position solder balls corresponding to circuit board design. This has increasingly led to cases of Fan-Out (*2) solder ball layouts. A Fan-Out layout with micro BGA(R) requires maintaining the stiffness of the TAB tape positioned on the outside of the semiconductor chip.
In response, Hitachi Cable has developed a micro BGA(R) that achieves this fan-out without sacrificing existing micro BGA(R) performance, providing greater protection for the chip against physical shock, by molding the package semiconductor chip side in resin to match the TAB tape dimensions. Hitachi Cable has also developed a proprietary reel-to-reel automatic molding system to provide outstanding mass production technology.
Offering outstanding performance and ease of mass production, this mold-type micro BGA(R) will be applied in DDR II with rapid market growth forecast as next-generation memory for high-end servers and SDRAM for digital consumer use.
Involved in the development of the micro BGA(R) package since 1997, Hitachi Cable provides total support, from package development, design, and test manufacture to design and manufacture of the optimum TAB tape. Hitachi Cable will leverage this complete production system to provide timely package solutions in response to future market trends and customer demand.
Target sales for the micro BGA(R) package in fiscal 2004 are 2 billion yen.
*1: micro BGA(R) is a registered trademark of Tessera, Inc. of the U.S.A.
*2: "Fan-out"
Positioning solder balls outside the semiconductor chip is referred to as "fan-out." Positioning solder balls beneath the semiconductor chip is referred to as "fan-in."
Manufacturing site
Densen Works
3-1-1 Sukekawa-cho, Hitachi-shi, Ibaraki Pref. 317-0065, Japan
Fig.1: Basic constructio
